Octavo OSD32MP2 System-in-Package (SiP) packs an STM32MP25 SoC, DDR4, EEPROM, and passive components into a single chip
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Octavo Systems OSD32MP2 is a family of two System-in-Package (SiP) modules, comprised of the OSD32MP2 and OSD32MP2-PM, based on the STMicro STM32MP25 Arm Cortex-A35/M33 AI processor, DDR4 memory, and various components to reduce the complexity, size, and total cost of ownership of solutions based on the STM32MP2 chips. The OSD32MP2 is a larger, yet still compact, 21x21mm package with the STM32MP25, DDR4, EEPROM, oscillators, PMIC, passive components, and an optional RTC, while the OSD32MP2-PM is even smaller at 14x9mm and combines the STM32MP25, DDR4, and passive components in a single chip. OSD32MP2 specifications: SoC – STMicro STM32MP25 CPU – Up to 2x 64-bit Arm Cortex-A35 @ 1.5 GHz MCU 1x Cortex-M33 @ 400 MHz with FPU/MPU; 1x Cortex M0+ @ 200 MHz in SmartRun domain GPU – VeriSilicon 3D GPU @ 900 MHz with OpenGL ES 3.2 and Vulkan 1.2 APIs support VPU – 1080p60 H.264, VP8 video decoder/encoder Neural [...]
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